EPO-TEK electrically conductive epoxies have been used successfully for over 35 years in a wide variety of applications including: IC packaging, hybrid microelectronics and circuit assembly as well as today in solar cell assembly, LEDs and high power management.
Epoxy Technology offers a full range of electrically and thermally conductive epoxy adhesives for the semiconductor, optoelectronic, automotive, aerospace and electronic assembly industries. Our extensive product line allows users to easily select the optimal adhesive for their specific application; based on the bescombination of physical, electrical and mechanical characteristics.
02 Product list
|Name||Description||Technical data sheet|
|EPO-TEK H20E||Two components, 100% solid silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. It is also available in a single components frozen syringe.Epoxy Technology’s Epo-Tek® H20E has been used successfully for over 35 years in a wide variety of applications including LED, solar, high power management and HDD applications.|
|New generation, single component ECA with exceptional thermal conductivity for high power applications with a thermal conductivity value ranging from 12.6 to 22.0 W/m°K.|
|New generation, two component ECA designed for low temperature curing from 23°C (ambient) to 80°C that exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.|
|EPO-TEK E2101||Two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications.|
|EPO-TEK E3001-HV||Snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. It is also available in a frozen syringe.|
|EPO-TEK E4110||Electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.|
|EPO-TEK E2189-LV||Low viscosity, two-component, room temperature curing conductive epoxy.|
|EPO-TEK EK1000||Single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques.|
|EPO-TEK EM127||Single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.|
|EPO-TEK H20E-PFC||Two components, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.|
|EPO-TEK H20S||Modified version of EPO-TEK®H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use.|
|EPO-TEK H31||Single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.|
|EPO-TEK H35-175MP||Single component, silver-filled epoxy for military hybrid die and component attach.|
|EPO-TEK H37-MP||Single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. It is also available in a frozen syringe.|
03 Complementary products
The THINKY PR-1 Nano Pre-mixer for nanoparticle dispersion and deagglomeration of CNT, graphene and other 2D nanomaterials is a patented design using a unique dual ultrasonic system to uniformly disperse nanomaterials before mixing into other materials.