Name | Description | Technical data sheet |
EPO-TEK MED 301EPO-TEK MED 301-2 |
Two component, clear and colorless, room temperature curing epoxies for sensor applications in IR and medical CT detectors. Both are USP Class VI approved. | |
EPO-TEK MED 302-3M
|
Two components epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating. | |
EPO-TEK MED 320
|
Two components, black-colored and optically opaque epoxy designed for optical, medical, and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. | |
EPO-TEK MED 353ND |
Well-known “standard in the industry”. | |
EPO-TEK MED 353ND-T |
Two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. | |
EPO-TEK MED 354EPO-TEK MED 354-T |
Two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy. | |
EPO-TEK MED 375 |
Two components, high Tg epoxy designed for semiconductor, hybrid, fiber optic and medical applications. | |
EPO-TEK MED 377 |
Two components, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications. | |
EPO-TEK MED H20E |
Two components, 100% solid silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. | |
EPO-TEK MED OD2002 |
Two component, high Tg epoxy with low modulus and good toughness. It is autoclavable and exhibits low stress on large core glass fibers in connectors. | |
EPO-TEK MED OG116-31 |
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries. | |
EPO-TEK MED OG198-54 |
Single components, UV curable epoxy adhesive, designed for encapsulation and DAM applications in medical. |
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