NEA 155 is a soft, smooth, thixotropic paste that can be readily applied by syringe, screen printing or pin transfer techniques. It is ideal for bonding SMT devices to printed circuit boards so that they can pass through the solder bath without shifting.
The advantage of this adhesive is its long shelf life and fast cure. The adhesive will not dry out, change viscosity or cure up under normal handling conditions making it ideal for automated equipment.
NEA 155 shows excellent adhesion to printed circuit boards, ceramics, metals and many plastics. When cured it has excellent electrical resistance that will not change or deteriorate with age.
Specifications of NEA 155
| Viscosity | Thixotropic paste |
| Color | Red |
| Cure Schedule | |
| 125° C
150° C |
20 minutes
10 minutes |
| Service Temperature | |
| Continuous
Intermittent |
150° C
300° C |
| Shelf Life | 4 months at room temp. |
Typical Properties of NEA 155
| Dielectric Constant (1 MHz) | 4.0 |
| Dissipation Factor (1 MHz) | 0.045 |
| Volume Resistivity (ohm-cm) | 1 x 10 15 |
| Surface Resistivity (Megohms) | 1 x 10 9 |
| Dielectric Strength (volts) | 980 |
| Arc Resistance (sec) | 95 |
