UV Cured
Epoxy Technology, Inc. offers a complete line of high performance Ultraviolet (UV) cure adhesives ranging in viscosity, flexibility, refractive index and light transmission.
UV cure epoxies provide advantages such as extremely fast curing rates, single component (no mixing) chemistries, solventless, accurate alignment of components, ease of automation, improved production rates and thermal energy savings over conventional systems (little power consumption) by the elimination of all or part of curing by heat.
The selection of an adhesive for a specific application depends on many factors such as viscosity, post-cure strength and hardness, shrinkage, Tg, the type of surface to be bonded, surface transparency, bond area and design/geometry. One must also consider the application method, such as having the proper viscosity/rheology to accurately deposit and apply the material. Another important criteria is refractive index. The refractive index of a material is the most important property of any optical system that transmits light. It is also used to calculate the focusing power of lenses, and the dispersive power of prisms.
UV cured epoxies may cure more slowly than acrylate based resins. Once the epoxy has been exposed to sufficient UV light, it will eventually cure at room temperature or very quickly with the addition of heat as a second step.
| Epo-Tek offers UV curing epoxies. Several optical grade formulations of varying viscosities and low shrinkage were developed primarily for fibre optic and opto-electronics applications. | ||||||
|---|---|---|---|---|---|---|
| Product | viscositycPs@23°C/rpm | hardness shore D | Tg°C | degradation temp °C | nD | % spectral transmission |
| OG113 | 143 / 100 rpm | 75 | 44 | 380 | 1.507 | 450-900nm >98% |
| UVO-114 | 510 / 100 rpm | 80 | 50 | 385 | 1.564 | 875nm >97% |
| OG115 | 4900/ 50 rpm | 86 | 59 | 400 | 1.574 | 450-900nm >98% |
| OG116 | 30000/ 10 rpm | 82 | 66 | 390 | 1.563 | 450-900nm >98% |
| OG116-31 | 25000/ 10 rpm | 82 | 90 | 390 | 1.563 | 450-900nm >98% |
| OG125 | 86 / 100 rpm | 69 | 55 | 145 | 1.456 | 450-900nm >97% |
| OG142 | 12,000 / 20 rpm | 86 | >95 | 400 | 1.5686 | 500-900nm >96% |
| OG142-6 | 23156 / 10 rpm | 86 | 85 | 400 | 1.5715 | n/a |
| OG147 | 35,000 / 10 rpm | 80 | >130 | 365 | black | thixotropic |
| OG159-2 | 120,000 / 2.5 rpm | >58 | 56/134 | 443 | 1.5679 | 900-2500nm, >95% |
| OG175 | 1700 / 100 rpm | 55 | 25 | 229 | 1.4473 | 400-900nm, >95% |
| OG603 | 300/ 100 rpm | 85 | 90 | 323 | 1.4768 | 375-900nm100% |
Product / Descriptions
- Epo-Tek® UVO-114 is a single components, UV curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries.
- Epo-Tek® OG116 is a single component, UV cured, high viscosity adhesive for opto-electronic applications including fiber optic packaging, sensor device, SCI-OEM optics and general electronic assembly. Notable qualities include high Tg and index of refraction.
- Epo-Tek® OG116-31 is a single components, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries.
- Epo-Tek® OG 125 is a single components, optically clear, low index of refraction, UV curable epoxy adhesive for fiber optic and opto-electronic device packaging.
- Epo-Tek® OG133-8 is a single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133-5, and a non-flow version of EPO-TEK® OG133-7.
- Epo-Tek® OG 142 is a single components, UV curable epoxy, designed for adhesive, sealing and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a high Tg epoxy, ideal for LCD and OLED applications.
- Epo-Tek® OG147 is a single component, optically opaque, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, circuit assembly, medical, and scientific/OEM industries. It is a high viscosity epoxy ideal for blocking out light in opto-packages.
- Epo-Tek® OG147-7 is a single component, thixotropic, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific / OEM industries. It is a high viscosity epoxy ideal for COB glob top “dam” encapsulation processes.
- Epo-Tek® OG 159-2 is a single components, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bond line control. Common applications include semiconductor, electro-optics, fiber optic,and scientific/OEM. It can be applied by screen printing or dispensing techniques. It is capable of coating, adhering, sealing, and encapsulating devices.
- Epo-Tek® OG175 is single components, optically clear, low refraction (Nd), UV curable epoxy adhesive for fiber optic and opto-electronic device packaging.
- Epo-Tek® OG 603 is a single components, low viscosity, UV curable adhesive designed for curing in seconds. It is an all-purpose, general adhesive for optical applications including fiber optic components, DVD, medical, and PCB level electro-optics. It can also be used for sealing and coating applications. It meets the requirements of USP Class VI biocompatibility standards for medical implants.