Therm. Conductive / Electric. Insulating

  Thermal Interface Materials selector guide

Epoxy Technology’s thermally conductive line of epoxies are used extensively in many high-tech electronic applications. EPO-TEK products are unparalleled in their performance in effectively removing heat, providing increased dielectric strength and protecting circuits from hostile environments. Our epoxy adhesive properties can range from rigid (providing robust, thermally enhanced circuit protection) to flexible (ideal for substrates with significant CTE mismatches).

 Representative examples:

  • Epo-Tek® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries.  It is a  low viscosity version of Epo-Tek® 920.
  • Epo-Tek® 930-4 is a two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle.  It is also available in a single component frozen syringe.
  • Epo-Tek®H65-175MP is a single component, alumina-filled epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
  • Epo-Tek®H67MP is a single component, thermally conductive epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
  • Epo-Tek® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
  • Epo-Tek®H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies.  It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.
  • Epo-Tek®H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.
  • Epo-Tek® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics.  Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.
  • Epo-Tek® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical industries. Epo-Tek® T7109-19 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications.  It is an alternative to Epo-Tek® T7109-17, designed for higher strength.
  • Epo-Tek® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors.  It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.
  • Epo-Tek® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.
  • Epo-Tek® TD 1001 is a single components, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.  Low Tg, several weeks of pot-life and low modulus are a few of its traits.  It is particularly suitable for bonding ferrite cores in power device plastic packaging.  It guarentees an excellent adhesion to PCBs, ceramics, most metals and lead-frames.
  • Epo-Tek® TV 2001 is a two components, thermally conductive, electrically insulating epoxy designed for  low stress semiconductor and electronics packaging.  Low Tg, moderate potlife, snap-curing and very low modulus are a few of its traits.  It is particularly suitable for bonding ferrite cores in power device plastic packaging.  It insures an excellent adhesion to PCBs, ceramics, most metals and lead-frames.  It is also available in a frozen syringe.
  • Epo-Tek® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heatsinking of semiconductors, hybrids, electronics, and optics.  It is also available in a frozen syringe.
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